In the spectral range beyond 1000 nm, there are currently very few LED chips available. Nevertheless, we offer the most important sizes in the range of 14 to 40 mil at wavelengths between 1000 and 2000 nm. The vertical chips are typically grown on a GaAs substrate, with the epitaxial layer located near the top.
Features:
- InGaAs material system
- Top-side metallization to distribute current flow across the entire chip surface for optimized light emission
- Vertical chip with one contact on the top side and the other across the entire back side
- Available wavelengths: 1050, 1350, 1450, 1550, 1650, 1720, and 1900 nm
- Near-Lambertian emission from the chip (120° viewing angle)
- Top and bottom contact surfaces are made of gold
- Customer-specific measurement qualification required
- The chips are measured on a wafer basis but are not binned
- Chips operating at 1050 nm and above 1600 nm are manufactured using the latest wafer-bonding technology, in which an additional reflective metallization layer is inserted between the substrate and the p-n junction. This results in significantly better power output compared to standard technology
- Low production volumes, therefore higher cost
Applications:
- Medical applications
- Spectroscopy
- Night vision and machine vision
- Monitoring
- Hyperspectral imaging
- Moisture detection
- Measurement of pressure marks on items such as fruit
- Measurement of water and sugar content in industrially produced foods
Chips 4 Light GmbH focuses on companies that have specific requirements for optoelectronic components and are looking for custom solutions, even for small and medium quantities.The company distributes LED chips, LEDs, detectors, and laser products from leading manufacturers and develops specialized optoelectronic components as well as custom modules—including those with a custom ASIC upon request. We manufacture prototypes and offer services such as measuring laser diodes and sorting LED chips onto various substrates—all according to customer specifications!